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Published: March 17, 2010
Find more content on: Manufacturing

Low-profile I/O cable assemblies designed to be a high-current-density alternative to cable-to-board power connectors


FCI, a developer of connectors and interconnect systems, has announced the introduction of the Pwr Profile+ line of low-profile I/O cable assemblies. Designed to be a high-current-density alternative to cable-to-board power connectors, the Pwr Profile+ connectors are based on reliable stamped and formed power contact technology. The cable assemblies and mating board mount headers have a height of 8.38 mm. 

The connectors are available with two power contacts for power and return applications, two signal pins for presence detection or power control and a grounding shield on the board connector for EMC requirements. The grounding shield is optional and can be omitted if the application does not have EMC concerns.

The signal pins for power control can be used for applications that require current or voltage monitoring or feedback regarding battery charge levels. The presence detection feature includes a jumpered signal contact that allows the system to monitor which ports have mated cables and which are empty. If power control or presence detection is not needed, the signal contacts can be omitted.

The connectors are rated to 37 A per power contact without exceeding a 30°C temperature rise in still air. The integrated latching system minimises the connector or cable footprint and the robust housing design includes touch-proof safety features as well as polarisation to ensure proper mating.

FCI
Etters, PA, USA  +1 717 938 7044

 

 

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