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Published: May 31, 2011
Find more content on: Materials

Plasma-Enhanced Chemical Vapour Deposition Offers Green Alternative for the Bonding of Metal Components


Plasmatech’s Micro-TIE plasma-enhanced chemical vapour deposition (PECVD) coating provides a “green” alternative for bonding or overmoulding metal components for medical devices. Surface preparation of metal components prior to bonding incompatible materials may require caustic chemical etchants or other costly conversion coatings to ensure good bonding to the base metal substrate. By depositing a thin polymerised coating it is possible to create a tie or interface layer that permits direct bonding or overmoulding to the metal surface.

Micro-TIE thin film is deposited directly onto a plasma precleaned substrate without exposure to the atmosphere. This continuous multistep process enhances adhesion to the base substrate because the polymerisation occurs at an atomic level.

Plasmatech provides contract processing services as well as a full line of low-pressure gas plasma and parylene coating equipment. Process development services are available for unique or especially challenging surface engineering requirements.
Plasmatech Inc.
Erlanger, KY, USA  +1 859 647 0730
www.plasmatechnology.com


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